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投稿时间：2009-06-30
投稿时间：2009-06-30
中文摘要: 采用电化学交流阻抗法与极化曲线法进行实验,研究了组氨酸及其与抗坏血酸复配溶液在0.25 ml/L盐酸溶液中对铜的缓蚀效果.结果表明,各种浓度的组氨酸及其与抗坏血酸复配溶液对铜电极腐蚀的阴极反应都有抑制作用,且随着组氨酸浓度的增大,缓蚀效果增强.此外,各浓度复配溶液的缓蚀效果比单独使用组氨酸的缓蚀效果好.
Abstract:The inhibition effect and mechanism of Arginine for copper and compositional amino-acid of copper in 0.25 mol/L HCl are investigated by potentiodynamic polarization curves and electrochemical impedance spectroscopy(EIS).It is showed that Histidine can retard the cathode process of the copper corrosion reaction.The compositional solutions also can retard the cathode process of the copper corrosion reaction and have better inhibition effect with the concentration(10-5~10-3 mol/L) increasing,the inhibition efficiency of histidine and the compositional solutions are improved.
keywords: copper corrosion inhibitors histidine antiscorbic acid
文章编号：20100212 中图分类号： 文献标志码：
基金项目:上海市曙光计划项目(O5SG53);上海市重点学科资助项目(P1304);上海市科委能力建设项目(0816051260)
引用文本：
郑红艾,沈莉莉.盐酸介质中组氨酸与抗坏血酸复配对铜的缓蚀作用[J].上海电力大学学报,2010,26(2):148-150.
ZHENG Hong-ai,SHEN Li-Li.Electrochemical Study on the Complex of Arginine and Antiscorbic Acid as Corrosion Inhibitors for Copper in HCL[J].Journal of Shanghai University of Electric Power,2010,26(2):148-150.
郑红艾,沈莉莉.盐酸介质中组氨酸与抗坏血酸复配对铜的缓蚀作用[J].上海电力大学学报,2010,26(2):148-150.
ZHENG Hong-ai,SHEN Li-Li.Electrochemical Study on the Complex of Arginine and Antiscorbic Acid as Corrosion Inhibitors for Copper in HCL[J].Journal of Shanghai University of Electric Power,2010,26(2):148-150.