Abstract:Based on the finite element method,the cooling of the printed circuit board is numerically simulated,and the cooling effect of the component layout on the circuit board under forced convection is analyzed,including the side-by-side and cross rows of components and the vertical and horizontal spacing between components.The temperature field and velocity field under the model are obtained.Shannon entropy and other evaluation indexes are introduced to quantitatively analyze the temperature field and velocity field.It is found that the cooling effect of side-by-side components is better than that of cross rows,and the closer the high-power chip is to the inlet of cooling gas,the better.The longitudinal spacing between components is as large as possible,and an appropriate transverse spacing is selected at the same time.